薄膜工艺产品说明书翻译-中英对照
主要用于微波、毫米波电路、高精密电路、光电子器件等。
产品有：微波衰减片、微波功分器、薄膜基板、精密电阻网络（芯片式）
（配相关照片）
1. Thin-film Technology Products
Mainly used for microwave, millimeter-wave circuits, high-precision circuits, optoelectronic devices.
Products include microwave attenuation film, microwave power divider, thin-film substrates, precise resistor network (Chip)
(Related photos provided)
2、封装外壳
华东微电子技术研究所封装事业部是中国领先的金属外壳供应商。生产的外壳产品共7个系列，400多个品种，外壳年产量达到50万套以上；外壳主要应用于混合集成电路、光电器件、半导体器件、声表面波器件、微波器件、压力传感器、固态继电器等产品的气密封装。外壳性能和可靠性指标达到MIL-STD-883E标准要求。华东微电子技术研究所的外壳产品不仅在国内各行业得到广泛应用，并且出口到意大利、韩国、美国、泰国、新加坡、英国等国。
2. Packaging Shell
Packaging Division of East China Micro-electronics Technology Research Institute is a domestic leading supplier of the metal shell. Shell products include seven series, more than 400 species; with annual output more than 500,000 units. Shell products are mainly used in Hermetic packaging of hybrid integrated circuits, optoelectronic devices, semiconductor, acoustic surface wave devices, microwave devices, pressure sensors, and solid-state relays. Shell performance and reliability reach MIL-STD-883E standards. Shell products of East China Institute of Microelectronic Technology are not only widely used domestic industry, but also export to Italy, South Korea, the United States, Thailand, Singapore, the United Kingdom and other countries.
外壳底座材料： 可伐合金（4J29）、冷轧钢、无氧铜、钨铜、铁镍合金（4J42）、316L、304L等
外壳封盖材料： 可伐合金（4J29）、铁镍合金（4J42）等
外壳引线材料： 可伐合金（4J29）、4J50、铜芯复合等
Shell base material: Kovar alloy (4J29), cold-rolled steel, oxygen-free copper, tungsten copper, iron-nickel alloy (4J42), 316L, 304L, etc.
Shell capping material: Kovar alloy (4J29), iron-nickel alloy (4J42)，etc.
Shell lead-wire material: Kovar alloy (4J29), 4J50, copper-core composite, etc.
3. LTCC生产线简介
华东微电子技术研究所拥有一条LTCC产品研制生产线，LTCC产品包括微波/毫米波电路，数字/模拟电路（MCM）以及无源集成元件等，如有源相控阵雷达T/R组件（S、C、X波段）、L波段雷达接收机前端模块、毫米波接收前端模块、毫米波无线引信模块、数字轴角转换器、量化器、滤波器、功分器、各种微波多层布线基板等，相关产品广泛应用于对于体积、重量和可靠性有要求的专业领域。
3. Introduction of LTCC Product Line
East China Micro-electronics Technology Research Institute has a LTCC development and production line. LTCC products include microwave/millimeter-wave circuits, digital/analog circuits (MCM) and passive integrated components, active phased array radar T/R module (S , C, X-band), L-band radar receiver front-end modules, millimeter wave receiver front-end modules, millimeter-wave wireless fuse module, digital rotary converters, quantizers, filters, power-dividers, and various microwave multi-layer line substrates. Related products are widely used in professional fields where requirements in size, weight and reliability are needed.
LTCC研制生产线的工艺水平如下：
线宽/间距 75μm
线条精度 ≤±5μm
翘曲度 ＜3mil/in
埋置元件 电阻、电容、电感
层数 30层
基板尺寸 150mm×150mm
检验标准 GJB2438A《混合集成电路通用规范》H级要求（相当于MIL-PRF-38534的H级）
Technology level of LTCC development and production line are as follows:
line-width/spacing 75 μm
line accuracy ≤ ± 5 μm
warp-degree <3mil/in
embedded components resistors, capacitors, inductors
number of layers 30
size of substrates 150mm × 150mm
inspection standards GJB2438A H-level requirements "Hybrid Integrated Circuits General Specification" (equivalent to MIL-PRF-38534 H-level)
4.ALN陶瓷基片(圣达公司材料)
用途及特点：主要应用于高功率混合集成电路、微波功率器件、半导体功率器件、电力电子器件、光电子部件、半导体致冷器等产品中作高性能基片材料和封装材料。其特点是热导率高，电性能好，热胀系数与硅片接近，机械强度高，无毒性，是取代BeO陶瓷的理想材料。
4. ALN ceramic substrate (Shengda Co.’s material)
Uses and features:
Mainly used as high performance substrate materials and packaging materials in high-power hybrid integrated circuits, microwave power devices, semiconductor power devices, electronic power devices, optoelectronics components, and semiconductor Cooling products. They are characterized by high thermal conductivity, good electrical properties, with thermal expansion coefficient close to silicon, high mechanical strength, non-toxic, and are the ideal substitute materials of BeO ceramic.
5.ALN陶瓷粉料
产品特点：是改善制成品的散热性和耐磨性。颗粒度细，纯度高，杂质含量低，粉料为ALN结晶相。
5. ALN ceramic powder
Features:
Improve manufactures’ thermal and wear resistance. Fine particle size, high purity, low impurity content, powders are ALN crystalline phase.
6.金属化ALN基片
ALN基片在应用中需要金属化。本公司可按用户对金属化基片不同用途及性能/价格比的要求，提供不同金属化ALN基片。
6. Metallized ALN substrate
ALN substrate needs to be metallized in the application. We can provide different metallized ALN substrate according to users’ requirements of uses and performance/price ratio.
7.KPB型晶闸管保护装置
用途及特点：采用低压高能MYN型ZnO压敏电阻器作为核心元件，是取代阻容（RC）模式装置的换代产品，用于大容量电力电子器件可控硅的过电压保护和能量吸收。具有限压、吸能双重功能，响应速度快（ns），自身功耗低（＜0.3W），节能显著，吸收能量大、重量轻、价格低、安装和维修方便。
7. KPB thyristor-protection device
Uses and features:
Using low-voltage high-energy MYN-type ZnO varistor as core component, it is substitute device of resistance-capacitance (RC) model. Mainly used for overvoltage protection and energy absorption for large-capacity power electronic devices thyristor. They are characterized by double functions--limiting pressure and absorbing energy, fast response (ns), low power consumption (<0.3 W), significant energy conservation, great energy absorption, light weight, low price and easy to install and maintain.
8.氧化锌压敏电阻器
用途及特点：广泛用于电力系统和电子线路中作瞬时过电压保护器件。具有电压非线性系数大、残压低、耐浪涌能力强、使用电压范围宽等特点。
8. Zinc oxide varistor
Uses and features:
It is widely used as transient over-voltage protection devices in power systems and electronic lines, and is characterized by high voltage coefficient of nonlinear, low residual voltage, strong resistance of surge voltage, and wide range of working voltage.
9.RYC型避雷器间隙专用高压电阻器
产品特点：
1、提高避雷器耐受系统短时工频过电压能力。
2、减轻ZnO阀片运行负担，降低阀片荷电率，提高阀片使用寿命。
3、间隙放电稳定好，分散性小。
4、降低避雷器残压和冲击系数，减小放电时延，提高响应速度。
5、结构简单，调整方便。
9. High-voltage resistor dedicated for RYC type arrester space
Features:
1. Improve arrester’s tolerance system’s capacity of short-term power frequency over-voltage
2. Reduce the operation burden of ZnO valve, reduce the valve charge rate, and improve the valve’s service life.
3. Good gap discharge stability, and small scatteredness.
4. Reduce arrester’s residual voltage, reduce discharge delay and improve response time.
5. Simple structure and easy to adjust
设备类：(恒力公司)
电子专用设备：
网带炉 烧结炉(照片)
Equipments (Hengli Co.)
Electronic Special Equipments:
Net Belt Furnace, Sintering Furnace (photo)
用于厚膜电路、电子元件电极、LTCC、钢加热器、太阳能电池板等产品的高温烧结、热处理
用于芯片焊接、金属封装、HTCC、DBC、VFD、PDP、汽车散热器、餐具等产品在保护气氛下的熔封、金属化、钎焊、氧化、退火等热处理工艺
钟罩炉(照片)
用于磁性材料、陶瓷材料、电子元件、粉末冶金产品等的预烧、烧结、共烧
推板炉(照片)
用于陶瓷材料、电子元件、粉末冶金产品的大批量排胶、预烧、烧结、退火等热处理过程
电镀生产线(照片)
用于镀金、镀镍、镀锡、镀铜、镀银、铝氧化、磷化、电解抛光等多种化学处理过程，如电子元件电极电镀、电子封装电镀等
Used for high-temperature sintering, heat treatment of thick-film circuit, electronic components electrode, LTCC, steel heaters, solar panels and other products.
Used for melt-sealing, metallizing, brazing, oxidation, annealing and other heat treatment process for chips-welding, metal-packaging, HTCC, DBC, VFD, PDP, car radiators, tableware and other products in the protective atmosphere.
Bell Furnace (photo)
Used for pre-burning, sintering and co-firing for magnetic materials, ceramic materials, electronic components, powder metallurgy products, etc.
Pushing plate Furnace (photo)
Used for large quantities of heat treatment process such as rubber-removing, pre-burning, sintering, annealing for ceramic materials, electronic components, powder metallurgy products.
Electroplating production line (photo)
Used for gold-plating, nickel-plating, tinning, copper-plating, silver-plating, aluminum-oxide, phosphating, electrolytic polishing, and other chemical processes, such as electroplating electronic component electrode, electronic package-electroplating, etc.
（照片）
1.EDA中心
２.厚膜生产线
３.激光划片机
４.溅射磁控设备
５.激光焊接机
６.图形检查系统
７.等静压测试
８.MCM印刷
9.封装数控
10.电子扫描显微镜
11.水汽含量分析仪
12.产品老化系统
13.X射线检查系统
14.LTCC基板
15.S波段
16.C波段
17.X波段
18.产品介绍
19.材料
20.精密薄膜电阻
21.材料产品推广部
22.电路产品推广部
23.封装外壳推广部
24.设备产品推广部
(photo)
1. EDA Center
2. Thick-film Production Line
3. Laser Dicing Machine
4. Magnetron sputtering equipment
5. Laser welding machine
6. Graphics Inspection System
7. Isostatic Pressing test
8. MCM printing
9. Numerical Control Packaging
10. Electron Scanning Microscope
11. Vapor content analyzer
12. Product Aging system
13. X-ray Inspection System
14. LTCC substrates
15. S band
16. C band
17. X-band
18. Product introduction
19. Material
20. Precision thin-film resistor
21. Material Products Promotion Division
22. Circuit Products Promotion Division23. Packaging Shell Promotion Division
24. Equipment Products Promotion Division
2012.12.21